Tag Archives: Solid State Technology

A Deeper Dive into Parameter Extraction with Gunter Kompa

Artech author Gunter Kompa gave us a thorough explanation of model parameter extraction and other optimization methods. Read on for a closer look: Bidirectional Search has Proved its Reliability not Only with Compact 15-Element Equivalent Circuits but also for Discussed Complex (Quasi-Distributed) Transistor Model Topologies Regarding model parameter extraction one distinguishes commonly between direct extraction …

Predicting Fusing Time of Overloaded PCB Traces Can We Predict It At All? with Douglas Brooks and Johannes Adam

When Traces Melt:  Figures 1 and 2 (Note 1) illustrate traces on two different boards. Each figure illustrates the trace at the moment it fuses (melts) due to a significant current overload. The fusing mechanisms are clearly different. So what was different? Here is the first hint. Assume there is a current that is just …

PCB Design Guide to Via and Trace Currents and Temperatures Douglas Brooks and Johannes Adam

We have assembled 20-plus years of knowledge into these pages. Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152 along with equations and simulations that fit those curves; (c) Sensitivity …

A Deeper Dive into High-Thoroughput Satellites with Hector Fenech

The satellite communication landscape is evolving. The traditional services are not sustaining the growth that the space industry is used to, and new services are showing new promises. Broadband access is such an area encompassing two main applications, namely fixed broadband and mobile broadband. In these days where economics are becoming the deciding factor in …

Predicting Fusing Time of Overloaded PCB Traces Can We Predict It At All? with Douglas Brooks, PhD and Dr. Johannes Adam

When Traces Melt:  Figures 1 and 2 (Note 1) illustrate traces on two different boards. Each figure illustrates the trace at the moment it fuses (melts) due to a significant current overload. The fusing mechanisms are clearly different. So what was different? Here is the first hint. Assume there is a current that is just …