Artech House is pleased to announce the publications of three titles in February 2021.
Electromagnetic Diffraction Modeling and Simulation with MATLAB
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This exciting new resource presents a comprehensive introduction to the fundamentals of diffraction of two-dimensional canonical structures, including wedge, strip, and triangular cylinder with different boundary conditions. Maxwell equations are discussed, along with wave equation and scattered, diffracted and fringe fields. Geometric optics, as well as the geometric theory of diffraction are explained. With MATLAB scripts included for several well-known electromagnetic diffraction problems, this book discusses diffraction fundamentals of two-dimensional structures with different boundary conditions and analytical numerical methods that are used to show diffraction.
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias will be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed.
Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
